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INTEGRATED CIRCUITS
DATA SHEET
SAA6581T RDS/RBDS demodulator
Product specification Supersedes data of 2001 May 07 File under Integrated Circuits, IC01 2002 Jan 14
Philips Semiconductors
Product specification
RDS/RBDS demodulator
FEATURES * Integrated switched capacitor filter * Demodulates European Radio Data System (RDS) or the USA Radio Broadcast Data System (RBDS) signals * Oscillator frequencies: 4.332 or 8.664 MHz * Integrated ARI clamping * CMOS device * Single supply voltage: 5 V * Extended temperature range: -40 to +85 C * Low number of external components. GENERAL DESCRIPTION The RDS/RBDS demodulator is a CMOS device with integrated filtering and demodulating of RDS/RBDS signals coming from a multiplexed input data stream. Data signal RDDA and clock signal RDCL are provided as outputs for further processing by a suitable microcomputer, for example CCR921 and CCR922. The SAA6581T replaces SAA6579 in function and pin-compatibility. QUICK REFERENCE DATA SYMBOL VDDA VDDD IDD(tot) Vi(MPX) fi(xtal) PARAMETER analog supply voltage digital supply voltage total supply current RDS input sensitivity at pin MPX crystal input frequency 4.0 4.0 - 1 - - ORDERING INFORMATION TYPE NUMBER SAA6581T PACKAGE NAME SO16 DESCRIPTION plastic small outline package; 16 leads; body width 7.5 mm MIN. 5.0 5.0 6.0 - 4.332 8.664 TYP. 5.5 5.5 - - - - APPLICATIONS
SAA6581T
The RDS/RBDS system offers a large range of applications from the many functions that can be implemented. For car radios the most important are: * Program Service (PS) name * Traffic Program (TP) identification * Traffic Announcement (TA) signal * Alternative Frequency (AF) list * Program Identification (PI) * Enhanced Other Networks (EON) information.
MAX. V V mA mV
UNIT
MHz MHz
VERSION SOT162-1
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
BLOCK DIAGRAM
SAA6581T
handbook, full pagewidth
560 pF +5 V SCOUT 8 C6 CIN 7 VDDD 12 10 SYNC C7 100 nF
multiplex input
C1
MPX 4
330 pF
57 kHz 8th ORDER BANDPASS FILTER
16 RDCL CLOCKED COMPARATOR RDS/RBDS DEMODULATOR 2 RDDA
SAA6581T
SIGNAL QUALITY DETECTOR
1 QUAL
+5 V C2 100 nF
VDDA 5
POWER SUPPLY AND RESET 6 VSSA 3 Vref C3 2.2 F
TEST CONTROL 15 TCON 9 MODE C4 47 pF
OSCILLATOR AND CLOCK 13 OSCI 14 OSCO C5 56 pF 11 VSSD
MHB899
Q1
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
PINNING SYMBOL QUAL RDDA Vref MPX VDDA VSSA CIN SCOUT MODE SYNC VSSD VDDD OSCI OSCO TCON RDCL PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION signal quality indication output RDS data output reference voltage output (1/2VDDA) multiplex signal input analog supply voltage (5 V) analog ground (0 V) comparator input switched capacitor filter output oscillator frequency select input ARI clamping control input digital ground (0 V) digital supply voltage (5 V) oscillator input oscillator output test control input RDS clock output Demodulator functions include:
handbook, halfpage
SAA6581T
QUAL 1 RDDA 2 Vref 3 MPX 4
16 RDCL 15 TCON 14 OSCO 13 OSCI
SAA6581T
VDDA 5 VSSA 6 CIN 7 SCOUT 8
MHB900
12 VDDD 11 VSSD 10 SYNC 9 MODE
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION RDS/RBDS signal demodulation BANDPASS FILTER The bandpass filter has a centre frequency of 57 kHz. It selects the RDS/RBDS sub-band from the multiplex signal MPX and suppresses the audio signal components. The filter block contains an analog anti-aliasing filter at the input followed by an 8th order switched capacitor bandpass filter and a reconstruction filter at the output. CLOCKED COMPARATOR The comparator digitizes the output signal from the 57 kHz bandpass filter for further processing by the digital RDS/RBDS demodulator. To attain high sensitivity and to avoid phase distortion, the comparator input stage has automatic offset compensation. DEMODULATOR The demodulator provides all functions of the SAA6579 and improves performance under weak signal conditions.
* 57 kHz carrier regeneration from the two sidebands (Costas loop) * Symbol integration over one RDS clock period * Bi-phase symbol decoding * Differential decoding * Synchronization of RDS/RBDS output data. The RDS/RBDS demodulator recovers and regenerates the continuously transmitted RDS/RBDS data stream in the MPX signal and provides clock RDCL for the output signals and data output RDDA for further processing by an RDS/RBDS decoder, for example CCR921 or CCR922. ARI CLAMP The demodulator checks the input signal for presence of RDS only, or RDS plus ARI transmissions. After a fixed test period, if the SYNC input is set HIGH the demodulator locks in the `verified' condition (see Table 1). If SYNC is set LOW, the ARI clamping is reset (disabled). After SYNC returns to HIGH, the demodulator resumes checking the input signal.
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
Table 1 SYNC LOW HIGH Control pin SYNC ARI CLAMPING internal ARI clamping disabled ARI clamping allowed to be logged Table 2 TCON HIGH HIGH
SAA6581T
Control pins TCON and MODE MODE LOW HIGH OSCILLATOR FREQUENCY 4.332 MHz 8.664 MHz
SIGNAL QUALITY DETECTION Output QUAL indicates the safety of the regenerated RDS data (HIGH = `good' data; LOW = `unsafe' data). Oscillator and system clock generator For good performance of the bandpass and demodulator stages, the demodulator requires a crystal oscillator with a frequency of 4.332 or 8.664 MHz. The demodulator can operate with either frequency (see Table 2), so that a radio set with a microcontroller can run, in this case, with one crystal only. The demodulator oscillator can drive the microcontroller, or vice versa.
The clock generator generates the internal 4.332 MHz system clock and timing signal derivatives. Power supply and internal reset The demodulator has separate power supply inputs for the digital and analog parts of the device. For the analog functions an additional reference voltage (12VDDA) is internally generated and available via the output pin Vref. The demodulator requires a defined reset condition. The demodulator generates automatically a reset signal after the power supply VDDA is switched on, or at a voltage-drop.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDD Vn Vi(MPX)(p-p) Ii Ilu(prot) PARAMETER supply voltage voltage at pins 1 to 4, 7 to 10, and 13 to 16 with respect to pins 6 and 11 input voltage at pin MPX (peak-to-peak value) pins 5 and 12 are connected to VDD note 1 CONDITIONS 0 -0.5 - -10 -100 -200 -10 -40 -65 note 2 note 3 Notes 1. Without latching in the entire temperature range. 2. Human body model (equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor). 3. Machine model (equivalent to discharging a 200 pF capacitor through a 0 series resistor and 0.75 H inductance). -4000 -500 MIN. 6.5 MAX. UNIT V
VDD + 0.5 6.5 V 6 +10 +100 +200 +10 +85 +150 +4000 +500 V mA mA mA mA C C V V
input current at pins 1 to 5, 7 to 11 and pins 6 and 11 are 13 to 16 connected to ground latch-up protection current in pulsed mode Tamb = -40 to +85 C with voltage limiting -2 to +10 V Tamb = 25 C with voltage limiting -2 to +12 V Tamb = -40 to +85 C without voltage limiting
Tamb Tstg Ves
ambient temperature storage temperature electrostatic handling voltage
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 104
SAA6581T
UNIT K/W
CHARACTERISTICS: DIGITAL PART VDDA = VDDD = 5 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supply VDDD IDDD Ptot Inputs VIL LOW-level input voltage at pins TCON, OSCI, SYNC and MODE HIGH-level input voltage at pins TCON, OSCI, SYNC and MODE input pull-up current at pins TCON and MODE VIH = 3.5 V - - 0.3VDDD V digital supply voltage digital supply current total power dissipation 4.0 - - 5.0 1.5 30 5.5 - - V mA mW PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VIH
0.7VDDD -
-
V
Ii(pu) Outputs VOL VOH
-10
-20
-
A
LOW-level output voltage at pins QUAL, RDDA and RDCL HIGH-level output voltage at pins QUAL, RDDA and RDCL
IOL = 2 mA IOH = -0.02 mA
- 4.0
- -
0.4 -
V V
Crystal parameters fi(xtal) crystal input frequency TCON = HIGH; MODE = LOW TCON = HIGH; MODE = HIGH fosc fosc(T) CL Rxtal adjustment tolerance of oscillator frequency temperature drift of oscillator frequency load capacitance crystal resonance resistance Tamb = -40 to +85 C - - - - - - 4.332 8.664 - - 30 - - - 30 x 10-6 30 x 10-6 - 120 pF MHz MHz
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
CHARACTERISTICS: ANALOG PART VDDA = VDDD = 5 V; Tamb = 25 C; measurements taken in Fig.1; unless otherwise specified. SYMBOL Supply VDDA VDDA - VDDD IDD(tot) Vref Zo(Vref) Vi(MPX)(rms) Vi(max)(p-p) analog supply voltage difference between analog and digital supply voltages total supply current reference voltage output impedance at pin Vref RDS amplitude (RMS value) maximum input signal capability (peak-to-peak value) f = 1.2 kHz RDS-signal; f = 3.2 kHz ARI-signal f = 57 2 kHz f < 50 kHz f < 15 kHz f > 70 kHz Ri(MPX) fc B-3dB GSCOUT-MPX sb input resistance f = 0 to 100 kHz Tamb = -40 to +85 C f = 57 kHz f = 7 kHz f < 45 kHz f < 20 kHz f > 70 kHz Ro(SCOUT) Vi(min)(rms) Ri output resistance at pin SCOUT f = 57 kHz Comparator input (pin CIN) minimum input level (RMS value) input resistance f = 57 kHz - 70 1 110 57 kHz bandpass filter centre frequency -3 dB bandwidth signal gain stop band attenuation 56.5 2.5 17 31 40 50 40 - 57.0 3.0 20 - - - - 30 VDDA = 5 V 4.0 - - 2.25 - 1 200 1.4 2.8 3.5 40 5.0 0 6.0 2.5 25 - - - - - - PARAMETER CONDITIONS MIN. TYP.
SAA6581T
MAX.
UNIT
5.5 0.5 - 2.75 - - - - - - - 57.5 3.5 23 - - - - 60
V V mA V k
MPX input (signal before the capacitor on pin MPX) mV mV V V V k
kHz kHz dB dB dB dB dB mV k
10 150
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
TIMING DATA
SAA6581T
handbook, full pagewidth
tCLKH
RDCL
TCLK td(clk)
td(clk)
RDDA
Tbit(slipped)
MHB901
Fig.3 RDS timing diagram including a phase change.
Table 3
RDS timing (see Fig.3) SYMBOL PARAMETER clock-data delay clock period clock HIGH time slipped data bit period 4 842 421 1263 TYP. s s s s UNIT
td(clk) TCLK tCLKH Tbit(slipped)
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm
SAA6581T
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013 EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 97-05-22 99-12-27
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
SAA6581T
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
Suitability of surface mount IC packages for wave and reflow soldering methods
SAA6581T
SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
SAA6581T
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
NOTES
SAA6581T
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
NOTES
SAA6581T
2002 Jan 14
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Philips Semiconductors
Product specification
RDS/RBDS demodulator
NOTES
SAA6581T
2002 Jan 14
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/02/pp16
Date of release: 2002
Jan 14
Document order number:
9397 750 09196

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